Ceramic precision cutting and marking system-Global supplier

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15800683989
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2nd Floor, Building 2, No. 88 Xifei Road, Jiuting Town, Songjiang District, Shanghai

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Ceramic precision cutting and marking system

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1. Using pulsed fiber laser, stable beam quality and performance;

2. Equipped with precision cutting head, small focusing spot, and excellent cutting effect;

3. The equipment is equipped with an optical marble platform, precision linear motor, and negative pressure adsorption system, ensuring accurate positioning and high processing stability.

Applicable materials: Sapphire, ceramics, silicon wafers, and brittle materials.

model Model	CL-FSC150Q	CL-FSC300Q
Single pulse energy Max.Single Pulse Power	15J	30J
Average power (continuous mode) Max. Average Power	150W	300W
peak power Maximum Pulse Energy	1500W	3000W
Laser wavelength（nm） Laser Wavelength	1070
Pulse width（MS） Pulse Width	0.2～50
way of working Working Mode	pulse/continuous Pulse/continuous
Motion Platform	precision linear motor
Processing format	400*400(Customizable)
Size of collapsed edge	＜30μm(depending on the material)
positioning	Red light/CCDVisual positioning (optional)
conicity	＜2°
Cutting thickness	≤2mm(Depending on the material)
cutting efficiency	5-20mm/s(Depending on the material)
dimensional accuracy	±20μm
Cooling method Cooling	forced air cooling
power supply Power Suppy	220V±10% 50HZ

Suitable for precision cutting of stainless steel thin metal plates, precision cutting and micro hole processing of precision components such as ceramics, alumina, zirconia, aluminum nitride, silicon wafers, sapphire, etc.

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